fig4

Figure 4. Structural characteristics of the MEMS infrared-light-source chip. (A) Step depth on the wafer surface; (B) FIB-SEM image of the suspended-membrane infrared-light-source chip; (C-E) EDS elemental distribution maps of Al, O, and Si; (F) Surface morphology of the fabricated polysilicon system; (G) Architecture of the infrared-light-source chip; (H) Infrared light source packaged in TO-39.