fig3

Microstructural origin of dual band emission and thermal dynamics in suspended silicon-on-insulator infrared sources

Figure 3. Curves of infrared-light-source chip temperature, stress, and deformation versus the center distance under a working voltage of 12 V. (A-C) Quantitative temperature, stress, and deformation data along the X-axis for suspended, semi-closed, and closed membrane infrared chips; (D-F) Quantitative temperature, stress, and deformation data along the Y-axis for the suspended, semi-closed, and closed membrane infrared chips.

Microstructures
ISSN 2770-2995 (Online)

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