fig5

Figure 5. Effect of processing environments. (A) Schematic diagram of the device for different processing environments. (B) Surface morphology of LIG fabricated in different processing environments of air and H₂. (C) The contact angle and O content in different processing environments. Reproduced with permission^[113]. Copyright 2017, WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim. (D) Correlations of square resistance with laser power for different processing environments. (E) XPS C1s peak of polyimide and LIG in air and Ar environments. (F) XPS O1s peak of polyimide and LIG in air and Ar environments. Reproduced with permission^[86]. Copyright 2016, Elsevier.